Fehleranalyse
Decapsulation
Frame based modules
- Package + Si-gel removal
- Polyimid removal
EMC-packages
- Epoxy removal via laser and plasma
Laser
- Coherent Easy Mark 5
- LED-laser
Plasma
- Pink V6-G
- O2 and CF4 plasma etching
- 300W microwave
Methodik
Optical analysis
- Flir A655sc thermal camera
- Keyence VHX-1000 digital microscope